JPH03102687A - ディスクカセット - Google Patents
ディスクカセットInfo
- Publication number
- JPH03102687A JPH03102687A JP22190390A JP22190390A JPH03102687A JP H03102687 A JPH03102687 A JP H03102687A JP 22190390 A JP22190390 A JP 22190390A JP 22190390 A JP22190390 A JP 22190390A JP H03102687 A JPH03102687 A JP H03102687A
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- case
- surface plate
- plate
- magnetic disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims abstract description 10
- 230000037431 insertion Effects 0.000 claims abstract description 10
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- -1 polyoxymethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22190390A JPH03102687A (ja) | 1990-08-23 | 1990-08-23 | ディスクカセット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22190390A JPH03102687A (ja) | 1990-08-23 | 1990-08-23 | ディスクカセット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03102687A true JPH03102687A (ja) | 1991-04-30 |
| JPH0526275B2 JPH0526275B2 (en]) | 1993-04-15 |
Family
ID=16773965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22190390A Granted JPH03102687A (ja) | 1990-08-23 | 1990-08-23 | ディスクカセット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102687A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0521374U (ja) * | 1991-08-19 | 1993-03-19 | 花王株式会社 | デイスクカートリツジ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498172A (en]) * | 1972-05-10 | 1974-01-24 | ||
| JPS5648157A (en) * | 1979-09-26 | 1981-05-01 | Nec Kyushu Ltd | Semiconductor device |
| JPH02249297A (ja) * | 1989-03-22 | 1990-10-05 | Toto Ltd | セラミックデバイスの焼成方法 |
-
1990
- 1990-08-23 JP JP22190390A patent/JPH03102687A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498172A (en]) * | 1972-05-10 | 1974-01-24 | ||
| JPS5648157A (en) * | 1979-09-26 | 1981-05-01 | Nec Kyushu Ltd | Semiconductor device |
| JPH02249297A (ja) * | 1989-03-22 | 1990-10-05 | Toto Ltd | セラミックデバイスの焼成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0521374U (ja) * | 1991-08-19 | 1993-03-19 | 花王株式会社 | デイスクカートリツジ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526275B2 (en]) | 1993-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |